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英语翻译急用,衷心谢谢

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英语翻译急用,衷心谢谢
In Figure 6 is given the SEM image taken after the experiment carried out with CBN cutting insert at cutting conditions of Vc: 300 m/min., f: 0.15 mm/rev., and ap: 0.4 mm. Flank wear, crater wear, newly developing notch wear, molten chip, and adhered chip on to the crater surface are observed. When the flank wear areas are studied, chips smeared under the effects of friction and pressure can be seen as
well as abrasion wear marks formed in the cutting direction cutting. Crater wear is observed at high cutting speeds. The reason for this may be the fact that the carbides in the hardened work piece separate the bonds of the CBN binder and abrade the tool [2]. The main reason for crater wear is the sliding of the chip on the chip surface of the tool. The sliding movement abrades the rises and decreases the waviness of the surface [5]. At the small cutting area, the crater wear occurred at the chamfer zone of the cutting tool. The shape of the crater wear on the tool is related to the distribution of the pressure along the chip surface [9]. The crater wear occurring consequently can change the geometry of the cutting area suddenly[5, 9]. While the fact that the cutting process is carried out on hardened pieces and at high cutting speed values is useful with regards to economy or quality, it
also causes the formation of high temperatures at the cutting region. The increasing temperature increases the diffusion effect that facilitates crater formation. Furthermore, high cutting speeds give rise to serious tribological condition at the tool-chip interface, causes the tool coating to peel and the tool to
act consequently as an uncoated tool [9]. When the figure is studied, the presence of chip can be seen that occurs at the region the contact of the chip with the tools ends and contact with air starts with a trend to develop. As a result, it can be said that effects of abrasive and intensely adhesive and diffusive wear mechanism are seen in the CBN cutter.
在图6中给出了扫描电镜拍摄与立方氮化硼切削实验进行后插入的切削条件下风险投资:300米/分钟。f:0.15毫米/转速。,美联社:0.4毫米,侧面磨损坑穿,新开发的切口,熔化的芯片,并坚持芯片陨石坑表面观察到。侧面磨损区域研究时,芯片上摩擦的影响和压力下可以被视为
以及磨损痕迹形成的切削方向切割。火山口穿是观察在高切削速度。原因可能是这样一个事实:淬火工件的碳化物单独的立方氮化硼粘结剂的债券和研磨工具[2]。火山口磨损的主要原因是芯片上的芯片表面的滑动的工具。滑动运动的上升,降低了波纹磨损表面[5]。小切削区域,火山口穿发生在倒角刀具的区域。陨石坑的形状穿在相关的工具是沿晶片表面压力的分布[9]。火山口穿发生因此能突然改变切削区域的几何形状(5、9)。而事实切削过程进行硬块和在高切削速度值是有用的对于经济或质量,
也会造成高温切削区域的形成。增加温度升高促进火山口形成的扩散效应。此外,高切削速度会导致严重的摩擦学的涂层对刀—屑条件的接口,使工具涂层皮和工具
因此作为一个裸露的工具[9]。图研究时,芯片的存在可以看出,发生在该地区的接触芯片的工具结束,与空气接触始于一个趋势发展。因此,可以说,磨料和强烈的胶粘剂,扩散磨损机制的影响在立方氮化硼刀具。